硅光子 · Silicon PhotonicsSilicon Photonics

全系列硅光芯片与系统Full-line Silicon Photonics Chips & Systems

从硅光器件、收发芯片、CPO 光引擎到光交换、光子传感与光计算系统,SiPhTec 以“设计—流片—封装—测试—系统”全链条能力,为 AI 数据中心、通信、自动驾驶、医疗与前沿计算提供光子解决方案。From silicon photonic devices, transceiver chips and CPO engines to optical switching, photonic sensing and optical computing systems, SiPhTec brings an end-to-end design → fab → packaging → test → systems capability to AI data centers, telecom, autonomous driving, healthcare and frontier computing.

全系列布局Full-line portfolio

从芯片到系统的完整光子产品线A complete photonic portfolio, from chips to systems

围绕芯片、光引擎与模块、系统以及工程服务四大方向布局。Organized around four pillars: chips, engines & modules, systems and engineering services.

芯片Chips

调制、探测、激光集成等核心硅光器件与收发芯片。Core silicon photonic devices — modulation, detection, laser integration — and transceiver chips.

光引擎与模块Engines & Modules

可插拔光模块、CPO 光引擎与光 I/O 芯粒。Pluggable modules, CPO engines and optical I/O chiplets.

系统Systems

OCS 光交换、光计算与光子传感系统。OCS switching, optical computing and photonic sensing systems.

服务Services

PDK、设计、封装与测试的一站式工程服务。One-stop engineering services: PDK, design, packaging and test.

产品线Product lines

10 大产品线10 product lines

覆盖光互连、光交换、光子传感、光计算与设计/封测服务。Spanning optical interconnect, switching, sensing, computing and design / packaging / test services.

01

硅光收发芯片 / 光模块Silicon Photonic Transceiver Chips / Optical Modules

02

CPO 共封装光学引擎CPO Co-Packaged Optics Engines

03

光 I/O 芯粒Optical I/O Chiplets

04

硅光调制器 / 探测器 / 激光集成Silicon Modulators / Photodetectors / Laser Integration

05

OCS 光交换OCS Optical Circuit Switching

06

LiDAR / FMCW 传感芯片LiDAR / FMCW Sensing Chips

07

生物 / 气体光子传感Bio / Gas Photonic Sensing

08

光计算 / AI 光互连Optical Computing / AI Optical Interconnect

09

封装与测试服务Packaging & Test Services

10

PDK / 设计服务PDK / Design Services

查看全部产品详情View all product details →

解决方案Solutions

面向关键行业的光子方案Photonic solutions for key industries

AI 数据中心AI Data Centers

电信 5G / 6GTelecom 5G / 6G

自动驾驶Autonomous Driving

医疗传感Medical Sensing

量子与光计算Quantum & Optical Computing

了解解决方案Explore solutions →

技术平台Technology platform

设计 → 流片 → 封装 → 测试 → 系统Design → Fab → Packaging → Test → Systems

贯通硅光产品开发全流程的工程化能力。Engineering capability across the full silicon photonics product lifecycle.

设计 → 流片 → 封装 → 测试 → 系统 / Design → Fabrication → Packaging → Test → Systems01设计DesignPDK · 仿真 · 版图PDK · Sim · Layout02流片Fabrication工艺协同 · MPWProcess · MPW03封装Packaging耦合 · 共封装Coupling · CPO04测试Test晶圆级 · 器件级Wafer · Device05系统Systems模块 · 光引擎Modules · Engines

了解技术能力Our technology →

与 SiPhTec 一起构建光互连的未来Build the future of optical interconnect with SiPhTec

欢迎就产品、方案、样品与合作进行咨询,我们的团队将尽快与您联系。Reach out about products, solutions, samples or partnerships — our team will get back to you.

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