芯片Chips
调制、探测、激光集成等核心硅光器件与收发芯片。Core silicon photonic devices — modulation, detection, laser integration — and transceiver chips.
从硅光器件、收发芯片、CPO 光引擎到光交换、光子传感与光计算系统,SiPhTec 以“设计—流片—封装—测试—系统”全链条能力,为 AI 数据中心、通信、自动驾驶、医疗与前沿计算提供光子解决方案。From silicon photonic devices, transceiver chips and CPO engines to optical switching, photonic sensing and optical computing systems, SiPhTec brings an end-to-end design → fab → packaging → test → systems capability to AI data centers, telecom, autonomous driving, healthcare and frontier computing.
围绕芯片、光引擎与模块、系统以及工程服务四大方向布局。Organized around four pillars: chips, engines & modules, systems and engineering services.
调制、探测、激光集成等核心硅光器件与收发芯片。Core silicon photonic devices — modulation, detection, laser integration — and transceiver chips.
可插拔光模块、CPO 光引擎与光 I/O 芯粒。Pluggable modules, CPO engines and optical I/O chiplets.
OCS 光交换、光计算与光子传感系统。OCS switching, optical computing and photonic sensing systems.
PDK、设计、封装与测试的一站式工程服务。One-stop engineering services: PDK, design, packaging and test.
覆盖光互连、光交换、光子传感、光计算与设计/封测服务。Spanning optical interconnect, switching, sensing, computing and design / packaging / test services.
贯通硅光产品开发全流程的工程化能力。Engineering capability across the full silicon photonics product lifecycle.
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