技术Technology

全流程硅光技术平台End-to-end Silicon Photonics Platform

设计 → 流片 → 封装 → 测试 → 系统,贯通产品开发每一个环节。Design → Fab → Packaging → Test → Systems — covering every step of product development.

开发流程Development flow

从设计到系统From design to systems

设计 → 流片 → 封装 → 测试 → 系统 / Design → Fabrication → Packaging → Test → Systems01设计DesignPDK · 仿真 · 版图PDK · Sim · Layout02流片Fabrication工艺协同 · MPWProcess · MPW03封装Packaging耦合 · 共封装Coupling · CPO04测试Test晶圆级 · 器件级Wafer · Device05系统Systems模块 · 光引擎Modules · Engines
核心能力Capabilities

技术能力Technical capabilities

光子设计与 PDKPhotonic Design & PDK

器件建模、线路仿真与版图设计流程,提供 PDK 支持。Device modeling, circuit simulation and layout flows, with PDK support.

工艺协同与流片Process Co-design & Fab

与晶圆制造工艺协同优化,支持多项目晶圆(MPW)与工程批。Co-optimization with wafer-fab processes, supporting MPW and engineering lots.

器件与激光集成Devices & Laser Integration

调制器、探测器、无源器件及多种激光集成路径。Modulators, detectors, passive components and multiple laser-integration approaches.

先进封装与耦合Advanced Packaging & Coupling

光纤耦合、光电共封装(CPO)与芯粒集成。Fiber coupling, co-packaged optics and chiplet integration.

测试与可靠性验证Test & Reliability

晶圆级与器件级光电测试,以及面向产品化的验证流程。Wafer- and device-level electro-optical test and product-oriented validation flows.

系统集成System Integration

从芯片到光模块、光引擎与系统的集成与调试。Integration and bring-up from chips to modules, engines and systems.

与 SiPhTec 一起构建光互连的未来Build the future of optical interconnect with SiPhTec

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